Business Area

Semiconductor

Excellent water resistance, adhesion, tensile strength, and elongation

CMP PAD Tape

CMP PAD fixing tape for semiconductor process

Highly heat-resistant tape that does not undergo chemical or physical deformation even at high temperatures due to the PAD polishing process and has excellent adhesion to various base films
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Name Thickness(mm) Adhesion(gf/25㎜) Holding power Color Remarks
CPT-0105Y 0.105 Room temp 2300 above / 60℃ 400 above No drop(80℃* 1kg* 12h) Yellow For fixing CMP pad