UV Dicing Tape
UV DICING tape for semiconductor process
Excellent pick-up characteristics during die bonding, and can be removed without residue due to reduced adhesion after UV curing
Semiconductor
Excellent water resistance, adhesion, tensile strength, and elongation
Move left and right to check.| Name | Thickness(mm) | Adhesion(gf/25㎜) | Holding power | Color | Remarks |
|---|---|---|---|---|---|
| DC3125E03 | 0.125 | Before UV 2500 above / After UV 20 below | - | Transparent | For glass dicing |
